Bonding of minimal quantities at the Bondexpo 2010
Faster, smaller, more complex - products have to provide more and more functions in the highest possible precision across different industries, using the smallest available space. Micro-components with complex geometries and short production times are in demand. The minimum quantity piston dispensing system (M-KDS) of RAMPF Dosiertechnik is seen as a reliable assistant for such applications. During the Bondexpo 2010 the system is bonding with a structural one-component polyurethane adhesive from partner RAMPF Giessharze.
The M-KDS is ideal for applying minimum amounts of highly filled materials, as frequently occurs in the electronics industry.
Miniaturized piston dispensing pump meters portions directly into the dynamic mixing head.
Miniaturized functional parts require the dosing of smallest amounts of highly filled sealing compounds. Such materials are frequently processed in the electronics and solar indus-tries and medical technology. The specialists at RAMPF Dosiertechnik were confronted with the task of developing a system for applying a two-component, electrically conducting adhesive on tension producing components. This gave the impetus for the development of the minimum quantity piston dispensing system (M-KDS). There were three constructional requirements, which were placed on the system. On the one hand, the system had to be able to dynamically mix filled sealing compounds. On the other hand, the dosing and mixing technology had to be compactly built, in order to avoid wastage and high output pressures. In addition, it had to be possible to arrange several mixing heads with small distances between them. Particularly challenging for this task was the design of the dispensing pump for mineral or metallic fillers. The pumps had to be extremely resistant to wear. The result convinces these days visitors of the Bondexpo 2010 in Stuttgart. The M-KDS dispenses the one-component polyurethane adhesive RAKU PUR® 49-2452 from sister company RAMPF Giessharze safely and economically on a metal disc. Thanks to the two-chamber system is always double the amount of adhesive available. The bonding in FIPG method allows an application without waste.
For materials with various viscosities
The piston system is electro-hydraulically driven. The linear drive concept for the dosing pistons reduces the construction volume and thus makes a very compact arrangement of the components possible. The material flow is controlled by the slide valves without dis-placement from the supply container into the mixing chamber. Materials can be processed in cartridges starting from 30 cm3 or from pressure vessels. No ventilation is necessary after changing the cartridge. This concept makes the processing of the most diverse one and two-component materials possible with a broad spectrum of viscosity.
Dispensing within 300 milliseconds
The small quantities are intensively mixed by the dynamic process. This is a decisive ad-vantage of the M-KDS. Moreover, the material is applied quickly and precisely. The short-est possible dispensing time is about 300 milliseconds. Due to volumetric dosing, con-tinuous, viscosity-independent dispensing results are obtained. Furthermore, reactive sealing compounds with a pot life starting from approx. five minutes can be processed.
Sealing compounds with a viscosity between 20 mPa*s and 200,000 mPa*s can be processed with the M-KDS.
RAMPF Technical Information:
The performance characteristics of the M-KDS at a glance:
- Dispensing output range 2 – 20 mm³/s (depending upon material)
- Smallest firing volume: approx. 1 mm³ with a mixing ratio of 100:30
- Largest firing volume: approx. 250 mm³
- Shortest dispensing time: approx. 300 ms
- Viscosities of components: 20 mPa*s – 200,000 mPa*s
- Pot lives: from approx. 5 min
- Range of mixing ratios: 100:100 to 100:5
- Optimal material preparation using a dynamic mixing system
- Extensive process monitoring options
- Related News:
Bondexpo 2010: RAMPF celebrates successful presentation - 20.09.10 16:22- From oven doors to prothesis: Bonding with induction at Bondexpo 2010 - 13.09.10 15:35
- Bonding at the push of a button at the Bondexpo 2010: RAMPF showcases bonding technology with induction - 23.07.10 15:14
- Links:
Bonding of minimal quantities, Bondexpo